Electronic Devices

Power modules, high-frequency devices, optical devices, LCD devices and others

IGBT Modules T Series with 7th-generation IGBT

Installation of the latest 7th-generation IGBT chips realises industrial equipment such as general-purpose inverters, lifts and uninterruptible power supply devices with lower power consumption and higher reliability. Available in two packages1 and two pin layouts2, a new line-up of 65 products contributes to providing the best devices for wide-ranging applications and diversified industrial equipment needs.

1.
NX package and standard package
2.
Choice of solder-pin or press-fit pin models

SLIMDIP Series of Power Semiconductor Modules

The size of the power semiconductor packages for driving the inverters of home appliances such as residential-use air-conditioners and refrigerators has been reduced by 30% compared to conventional products1, realising the world's smallest2 1.5 kW-class motor. The compact packages contribute to reducing the size and weight of the inverters used in home appliances.

1.
Super-mini Dual In-Line Package Intelligent Power Module (DIPIPM™) Ver. 6
2.
As of 23 April 2015, based on internal research

3.5 GHz-band GaN HEMT for Mobile Communications Base Transceiver Stations

Mitsubishi Electric has developed GaN1 HEMTs2 for use in Base Transceiver Stations (BTS) operating in the 3.5 GHz-band of fourth generation mobile communication systems.The four new GaN-HEMTs offer output power and efficiency levels that are among the highest3 currently available. High efficiency allows use of a simple cooling system, which contributes to the smaller size and lower power consumption of BTSs.

1.
Gallium nitride
2.
High Electron Mobility Transistor
3.
As of 22 December 2015, based on internal research

Compact Integrated 100 Gbps EML-TOSA

A high-performance EML1 helps to realise the industry's longest-distance2 (i.e., 40 km) transmissions. With a size reduction to just 30 per cent3 that of its predecessor, the new model will allow optical transceivers to be made more compact. This is expected to help reduce the size of 100 Gbps communication facilities and expand high-speed 100 Gbps optical transmission networks.

1.
Electro-absorption Modulated Laser diode
2.
As of 16 March 2016, based on internal research. IEEE 100GBASE-ER4 standards (based on Ethernet basic standards for 100 Gbps communication speed of the American Institute of Electrical and Electronics Engineers)
3.
Compared with FU-401REA, previous Mitsubishi Electric product.

7-inch WVGA TFT-LCD Module with Touch Panels for Industrial Use

The new TFT-LCD module with a projection-capacitive touch panel is able to operate with 5-mm-thick cover glass, multi-touch up to a maximum of 10 points, the use of thick heat-resistant gloves and a wet screen. It is optimised for outdoor applications through pursuit of shock resistance and water resistance.

Tough Series 10.4-inch SVGA Colour TFT LCD Modules for Industrial Use

In addition to the industry's highest1 anti-vibration performance (i.e., 6.8 G acceleration) and a wide guaranteed temperature operating range (-40°C to +85°C), ultrabright visual display (1,500 cd/m2) is realised. This contributes to improving the visual quality of large-screen, high-brightness displays used in harsh environments outside, such as panels for construction machinery, agricultural machinery and machining tools.

1.
As of 25 November 2015, based on internal research